| 规格 | AMD Instinct MI300A | AMD Instinct MI250X |
|---|
| 架构 | CDNA3 APU融合封装 (Zen4 EPYC 24核CPU@峰值3700MHz + CDNA3 GPU, TSMC 5nm|6nm FinFET, 1460亿晶体管) | CDNA2 (双GCD双die封装, TSMC 6nm FinFET) |
| 显存 | 128GB HBM3 (CPU+GPU统一共享内存, Full-Chip ECC, Infinity Cache Yes) | 128GB HBM2e (Full-Chip ECC, 双die合计) |
| 显存带宽 | 5.3 TB/s | 3.2 TB/s (1.6TB/s×双GCD) |
| 显存位宽 | 8192-bit (Memory Clock 5.2 GHz) | 8192bit (双die合计) |
| 算力 | FP64 61.3 / FP64 Matrix 122.6 / FP32 122.6 / TF32 Matrix 490.3 / FP16·BF16 980.6 / FP8 1.96 PF / INT8 1.96 POPs (TFLOPS, Peak Engine Clock 2100MHz; FP8/FP16/INT8稀疏翻倍) | FP64 47.9 / FP64 Matrix 95.7 / FP32 47.9 / FP16·BF16 383 / INT8·INT4 383 TOPS (TFLOPS, 双die合计, Peak Engine Clock 1700MHz) |
| 计算单元 | GPU 228 CU / 14592 流处理器 / 912 Matrix Cores + CPU 24核 Zen4 (任务brief预设304CU系MI300X数字, MI300A官方页228为准) | 220 CU / 14080 流处理器 (双GCD合计) |
| 功耗 | 550W (TDP) | 760W Peak | 500W (TDP) | 560W Peak |
| 互联 | Infinity Fabric 8链 (峰值128GB/s/链) / PCIe 5.0 x16 | Infinity Fabric 8链 (峰值100GB/s/链) / PCIe 4.0 x16 |
| 发布年 | 2023 (官方Launch Date 12/06/2023, Advancing AI大会与MI300X同场) | 2021 (官方Launch Date 11/08/21) |
| 形态 | APU SH5 Socket (非MI300X的OAM模组, 冷却Passive & Active) | OAM Module, Passive OAM (被动散热) |